STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, today introduced ST SafeSense VD56GA, a 1.1 MP automotive image sensor for infrared in-cabin sensing. The sensor enables OEMs and Tier 1 suppliers to scale driver and occupant monitoring across vehicle lines while balancing performance, integration, and cost.
As driver and occupant monitoring expands across a broader range of vehicle platforms, automakers and suppliers are looking for imaging solutions that can deliver strong in-cabin performance without adding unnecessary system cost or design complexity. The VD56GA image sensor addresses this need with a compact sensor architecture, high infrared sensitivity, and embedded image-processing capabilities. This combination is designed to provide the image quality required for driver and occupant monitoring while maintaining the size and cost advantages of a compact sensor format. In many in-cabin applications, the VD56GA can help customers meet performance targets without requiring a larger and more expensive sensor.
“In-cabin sensing is moving beyond premium platforms, and carmakers need cost-effective solutions they can deploy broadly,” said Alexandre Balmefrezol, Executive Vice President and General Manager of the Imaging Sub-Group at STMicroelectronics. “With VD56GA, we focused on the system-level tradeoffs that matter most: image quality in infrared conditions, compact integration, and a cost structure that supports high-volume programs. Equally important, the sensor benefits from ST’s Integrated Device Manufacturer model, with front-end manufacturing in Crolles, France, giving customers greater supply-chain resilience, quality control, and long-term support for automotive programs.”
“As driver and occupant monitoring systems move into a broader range of vehicle platforms, OEMs are increasingly focused on solutions that can be deployed at scale, with volumes set to exceed 70 million units by 2031. Success in this market depends not only on imaging performance, but also on reducing system cost, simplifying integration, and enabling adoption across high-volume vehicle programs,” (*) underlined Anas Chalak, Market & Technology Analyst, Imaging at Yole Group.
Helping carmakers scale driver and occupant monitoring
VD56GA is designed to help reduce the cost of the complete camera module. Its imaging performance enables the use of lower-cost optics, simplified infrared illumination, less demanding optical filtering, and no external image-processing. For OEMs and Tier 1s, that can translate into a more cost-effective path to deploying driver and occupant monitoring across a broader range of vehicle programs.
The sensor leverages a new backside-illuminated pixel architecture, called ST DeepNIR, optimized for infrared imaging. With 35% higher modulation transfer function (MTF) sharpness and nearly 60% higher quantum efficiency than the previous generation, VD56GA is currently the only sensor in its class to achieve this level of combined optical resolution and infrared sensitivity, helping in challenging conditions like under display camera.
By extracting more performance from a compact 1.1 MP architecture, VD56GA helps automotive designers achieve the image quality required for advanced sensing functions, while benefiting from the integration and cost advantages of a compact sensor architecture.
Compact integration with embedded image processing
Designed for modern automotive camera modules, VD56GA is housed in a compact 3.7 mm x 3.2 mm CSP package, making it suitable for space-constrained installations and next-generation in-cabin camera designs.
The device also integrates a range of embedded image-processing functions, including mirror, crop, dark calibration, auto exposure, and piecewise-linear processing. These features remove the need for external image-processing resources, simplify camera design and speed development.
Support for both RAW and YUV output formats give OEMs and Tier 1 suppliers flexibility across different electronic architectures and software environments, making it easier to adapt the device to a broad range of implementation strategies.
Building on ST’s automotive imaging leadership
VD56GA builds on ST’s established presence in automotive imaging and in-cabin sensing. Earlier this year, ST announced shipment of its 10 millionth automotive of SafeSense by ST image sensors, reflecting broad adoption across key automotive regions, including Europe, Asia, and the United States.
Customers benefit from ST’s vertically integrated manufacturing model and secure supply chain, with front-end manufacturing of VD56GA takes place at ST’s facility in Crolles, France and packaging in Asia; reinforcing the company’s focus on industrial resilience, product quality, and supply continuity for automotive customers worldwide.
