HomePress ReleaseiWave unveils TI AM62Ax Solderable SoM for Competitive Automotive & Automation Solution

    iWave unveils TI AM62Ax Solderable SoM for Competitive Automotive & Automation Solution

    Through a collaboration with Texas Instruments (TI), iWave Systems is excited to introduce iW-RainboW-G55M: TI AM62Ax Solderable System on Module (SoM). The SoM is powered by Texas Instruments AM62Ax Sitara processors and is built on the OSM v1.1 solderable SoM standard, offering an extensive set of interfaces in a compact form factor.

    The iW-RainboW-G55M leverages the TI AM62Ax automotive-grade family of heterogeneous Arm®-based processors with its quad Arm Cortex®-A53 CPUs, a vision processing and deep learning accelerator, Arm Cortex-R5F CPUs for control and device management, display interface, extensive automotive peripheral and networking options, allowing for the development of products and solutions that require the implementation of man-machine synergy at the edge.

    iWave adapted the OSM standard for the TI AM62Ax SoM to provide the user with a compact form factor, ruggedness (vibration resistance), and technology scalability based on the processor and application needs. The SoM enables customers to shorten their time to market with reduced risk and complexity.

    Key features of iW-RainboW-G55M OSM SoM

    • AM62Ax processor
      • 4 x Cortex- A53 @ 1.4GHz
      • 1 x Cortex-R5F @ 800MHz (MPU Channel with FFI)
      • 1 x Cortex-R5F @ 800MHz (to support Device Management)
      • C7xV-256 Deep Learning Accelerator (up to 2 TOPS)
      • 2GB LPDDR4 RAM, 16GB eMMC Flash, 16Mb QSPI Flash
      • Compliant with AEC-Q104 Global Standard
      • IEEE 802.11 ac/ax, IEEE 802.15.4, and Bluetooth 5.3 Connectivity
      • 2 x RGMII, 2 x USB 2.0, 1 x SD (4-bit)
      • 1 x MIPI CSI, RGB 18-bit, I2S Audio x2
      • 3 x UART, 1 x CAN, 2 x I2C, 1 x QSPI, 3 x GPIO, 2 x PWM
      • MCU interfaces – 1 x MCAN, 1 x I2C, 1 x SPI, 2 x UART, 8 x GPIOs
      • Size-LF Form Factor: 45 mm x 45 mm
      • Solderable LGA Package in OSM v1.1 Standard
      • 622 Contacts
      • Linux & Free RTOS OS Support

    The TI AM62Ax SoM satisfies diverse memory requirements and interfaces for embedded applications. With 2GB LPDDR4 (Expandable up to 8GB), 16GB eMMC Flash (Expandable up to 128GB), 16Mb QSPI Flash, and enhanced external memory access can meet diverse application needs. An onboard Wi-Fi 6 + BT 5.3 + LR-WPAN module gives needed wireless connectivity versatility, while a pair of CAN and ethernet connectors with TSN compatibility enables industrial/automotive deterministic networking options. The iW-RainboW-G55M OSM expands the RGB display interface and Camera peripheral to bring multimedia and AI @ Edge.

    “By collaborating with TI, iWave aims to enable product development for customers through an extensive portfolio of embedded computing platforms on the TI AM62Ax processor series. The System on Module and Single Board Computers from iWave are targeted towards industrial, automation and automotive applications,” says Mr Abdullah Khan M Director-Engineering at iWave Systems.” Through a well-established product longevity program and manufacturing eco-system, iWave helps customers focus on their core competencies and reduce their time to market.”

    “TI vision processors like the AM62A family are easy to use, with integrated AI accelerators, common software, and open-source machine learning frameworks and models,” said Artem Aginskiy, general manager, Processors, Texas Instruments. “The new TI AM62Ax-based SoM from iWave further streamlines embedded designs – helping engineers expand the AI and vision processing capabilities of their automotive and industrial systems.”

    AM62Ax OSM SoM is available on a carrier board as a Single Board Computer (SBC), which can also be used as an evaluation kit. This feature-rich multimedia insert-ready SBC is available in Pico-ITX form factor, ready to be integrated across diverse automotive and automation markets.

    Key features of AM62Ax Single Board Computer

    • AM62Ax processor
    • 2GB LPDDR4 RAM, 16GB eMMC Flash, 16Mb QSPI Flash
    • Micro SD, M.2 connector Key B (USB, Nano SIM Connector)
    • Gigabit Ethernet (RGMII), USB 2.0 OTG, USB 2.0 Host
    • RS232 x1, CAN x1, GNSS receiver
    • 5mm Audio IN/OUT Jack, Speaker Header
    • Expansion: CAN x1, SPIx1, PWM x1, UART x2
    • DC 12V Input, -40°C to +85°C Industrial
    • 100mm x 72mm
    • Linux 5.4.7(Or higher), Free RTOS

    The System on Module and Single Board Computer are go-to-market and production ready complete with documentation, software drivers, and a board support package.

    With a built-in Hardware Security Module, Advance power management, AEC-Q104*, compatibility for open-source operating systems, and a product longevity cycle of 10+ years, the iW-RainboW-G55M OSM is ideally suited for competitive application in the automotive, broad set of industrial applications, and automation markets.

    Himanshu Vaibhav
    Himanshu Vaibhavhttps://www.timesev.com/
    Himanshu Vaibhav is a distinguished Technology Journalist associated with ELEtimes.com and TimesEV.com. With expertise in researching, writing, and editing, he demonstrates a deep understanding of technology, particularly in the EV industry. His continuous updates on EV, Automotive, and E-mobility industries reflect his commitment to staying at the forefront of emerging trends.

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